Effect of the distance between the micro/nanostructures on pool boiling heat transfer with water on a copper heater

Abstract Copper heaters were made. On the surface of these arrays micrococoons synthesized from silicon oxide (SiO x ) nanowires with different concentrations micro/nanostructures and hence average distances between them. Boiling curves obtained for samples it was found that heat transfer enhancement during boiling occurs on them in comparison a smooth copper surface. It shown effect increases decreasing concentration reaches maximum microrelief an approximate microstructures equal to unity per square micron. surfaces are sufficiently stable suitable enhancing boiling.